ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,654, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Hod... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,655, issued on Sept. 22, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device provided with insulating element bonded to in... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,656, issued on Sept. 22. "Power module" was invented by Brice McPherson (Fayetteville, Ark.), Brandon Passmore (Fayetteville, Ark.), Rober... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,657, issued on Sept. 22, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Integration structure fo... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,658, issued on Sept. 22, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Method and apparatus to reduce complexity and cost for multi... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,659, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including semiconduc... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,660, issued on Sept. 22, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Jap... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,661, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Scalable extreme large size substrate integration" was invented ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,662, issued on Sept. 22, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Molded thin semiconductor die packa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with gla... Read More